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millipacs® hardmetric connectors for industrial applications 用于工业应用的Millipacs®硬测量连接器

Amphenol offers most reliable 2mm Hardmetric series Millipacs® Backplane connectors.  With high-reliability features, stacking, standard length modules, EMI top & bottom shielding, hot swapping capability, density, and durability Amphenol’s Millipacs® is one of the best solutions available in the industry for rugged and reliable applications in multiple industrial segments.

It is ideal for use in rugged and reliable applications in multiple market segments including Industrial & Instrumentation, smart grid, medical, aviation, railway, military, space, automotive besides telecom and data in Backplane, Mezzanine, Coplanar, Offset Coplanar and Input Output architecture.

Millipacs® offers both low-speed and high-speed connectors of up to 25Gbps with mating compatibility between different versions and hybrid solutions (signal & power). Its hard metric configuration designed in accordance to IEC 917, IEC 61076-4-101, Telcordia GR-1217-CORE standards and fulfills Compact PCI bus architecture

While most high-speed backplane connectors currently in the market come with single side bifurcated beam on the blade, Millipacs® is featured with the 2-beam twisted tulip contact, which provides an equalized signal path, two contact points for reliability and performs superiorly in an environment subject to shock and vibration. Millipacs® has withstood USCAR-V2 specifications for shock and vibration test conditions as well as high temperature life testing for 1000 hours at 125°C.

To address the markets growing requirement for higher data rate and rugged features, Amphenol is pushing the envelope with enhanced versions ofMillipacs® series. CurrentlyMillipacs® offers 25Gb/s + data rate capable versions with backward mating compatibility to the first generation 2mm Hardmetric cPCI compatible connector. This has enhanced the life of the installed systems. There are options for protective covers which prevents dust and accidental bending of pins for backplane headers, high operating temperature (up to +175°C) etc making it suitable for rugged applications.

Millipacs® series offers high-speed interconnect solutions packaged with reliable and rugged features for various embedded computing backplane applications. With thousands of configurable options, we have the product to meet your performance and quality requirements. We will continue to come up with further upgrades based on the market requirement. Partner with us for your customized connection needs. With advanced engineering and fast prototyping, we can provide a solution with the short lead time. Check out Millipacs® website to know more on the connectors suiting various requirements.

安酚提供最可靠的2mm硬测量系列Millipacs®背板连接器。 具有高可靠性的特点,堆叠,标准长度模块,EMI顶部和底部屏蔽,热交换能力,密度和耐用性Amphenol的Millipacs®是行业中最好的解决方案之一,可用于多个工业部门的坚固和可靠的应用。
它是理想的应用在多个市场细分,包括工业和仪表,智能电网,医疗,航空,铁路,军事,空间,汽车,除了电信和数据在背板,夹层,共面,偏移共面和输入输出架构。
Millipacs®提供高达25Gbps的低速和高速连接器,具有不同版本和混合解决方案(信号和功率)之间的匹配兼容性)。 它的硬度量配置设计符合IEC917,IEC61076-4-101,TelcordiaGR-1217-CORE标准,并满足紧凑的PCI总线架构
虽然目前市场上的大多数高速背板连接器都有单面分岔光束在叶片上,但Millipacs®的特点是2束扭曲郁金香接触,它提供了一个均衡的信号路径,两个接触点的可靠性,并在受冲击和振动的环境中表现优越。 Millipacs®经受住了USCAR-V2规范的冲击和振动测试条件,以及在125°C下1000小时的高温寿命测试。
为了满足市场对更高数据速率和坚固特性的日益增长的需求,Amphenol正在推出Millipacs®系列的增强版本。 目前,Millipacs®提供了25Gb/s数据速率能力的版本,与第一代2mm硬测量cPCI兼容连接器具有向后匹配兼容性。 这提高了安装系统的寿命。 有选择的保护罩,以防止灰尘和意外弯曲的引脚背板头,高工作温度(可达175°C)等,使它适合坚固的应用。
Millipacs®系列提供高速互连解决方案,为各种嵌入式计算背板应用提供可靠和坚固的特性。 有成千上万的可配置选项,我们有产品满足您的性能和质量要求。 我们将继续根据市场需求提出进一步的升级。 与我们合作,为您的定制连接需求。 通过先进的工程和快速的原型,我们可以提供一个解决方案的短准备时间。 查看Millipacs®网站,了解更多适合各种需求的连接器。
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