Amphenol offers most reliable 2mm Hardmetric series Millipacs® Backplane connectors.  With high-reliability features, stacking, standard length modules, EMI top & bottom shielding, hot swapping capability, density, and durability Amphenol’s Millipacs® is one of the best solutions available in the industry for rugged and reliable applications in multiple industrial segments.

It is ideal for use in rugged and reliable applications in multiple market segments including Industrial & Instrumentation, smart grid, medical, aviation, railway, military, space, automotive besides telecom and data in Backplane, Mezzanine, Coplanar, Offset Coplanar and Input Output architecture.

Millipacs® offers both low-speed and high-speed connectors of up to 25Gbps with mating compatibility between different versions and hybrid solutions (signal & power). Its hard metric configuration designed in accordance to IEC 917, IEC 61076-4-101, Telcordia GR-1217-CORE standards and fulfills Compact PCI bus architecture

While most high-speed backplane connectors currently in the market come with single side bifurcated beam on the blade, Millipacs® is featured with the 2-beam twisted tulip contact, which provides an equalized signal path, two contact points for reliability and performs superiorly in an environment subject to shock and vibration. Millipacs® has withstood USCAR-V2 specifications for shock and vibration test conditions as well as high temperature life testing for 1000 hours at 125°C.

To address the markets growing requirement for higher data rate and rugged features, Amphenol is pushing the envelope with enhanced versions ofMillipacs® series. CurrentlyMillipacs® offers 25Gb/s + data rate capable versions with backward mating compatibility to the first generation 2mm Hardmetric cPCI compatible connector. This has enhanced the life of the installed systems. There are options for protective covers which prevents dust and accidental bending of pins for backplane headers, high operating temperature (up to +175°C) etc making it suitable for rugged applications.

Millipacs® series offers high-speed interconnect solutions packaged with reliable and rugged features for various embedded computing backplane applications. With thousands of configurable options, we have the product to meet your performance and quality requirements. We will continue to come up with further upgrades based on the market requirement. Partner with us for your customized connection needs. With advanced engineering and fast prototyping, we can provide a solution with the short lead time. Check out Millipacs® website to know more on the connectors suiting various requirements.