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BergStak® 0.80mm Pitch
  • 产品概述
  • 主要用途
  • 产品规格
basics bergstak® 0.8mm is a flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 pcb stack heights in 9 sizes up to 200 positions.  housing and terminal profile guarantees support of up to 12gb/s  vertical versus vertical mating configuration  40 to 200 position sizes in 20 position increments  5mm to 20mm stack heights in 1mm increments
 
基本的伯格斯塔克®0.8mm是一个灵活的解决方案设计的高速和高密度,平行板对板连接器系统与16pcb堆栈高度在9个尺寸到200个位置。外壳和终端轮廓保证支持高达12gb/s垂直与垂直配合配置40到200位置尺寸20位置增量5mm到20mm堆栈高度1mm增量
basics bergstak® 0.8mm is a flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 pcb stack heights in 9 sizes up to 200 positions.  housing and terminal profile guarantees support of up to 12gb/s  vertical versus vertical mating configuration  40 to 200 position sizes in 20 position increments  5mm to 20mm stack heights in 1mm increments
 
基本的伯格斯塔克®0.8mm是一个灵活的解决方案设计的高速和高密度,平行板对板连接器系统与16pcb堆栈高度在9个尺寸到200个位置。外壳和终端轮廓保证支持高达12gb/s垂直与垂直配合配置40到200位置尺寸20位置增量5mm到20mm堆栈高度1mm增量
basics bergstak® 0.8mm is a flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 pcb stack heights in 9 sizes up to 200 positions.  housing and terminal profile guarantees support of up to 12gb/s  vertical versus vertical mating configuration  40 to 200 position sizes in 20 position increments  5mm to 20mm stack heights in 1mm increments
 
基本的伯格斯塔克®0.8mm是一个灵活的解决方案设计的高速和高密度,平行板对板连接器系统与16pcb堆栈高度在9个尺寸到200个位置。外壳和终端轮廓保证支持高达12gb/s垂直与垂直配合配置40到200位置尺寸20位置增量5mm到20mm堆栈高度1mm增量
basics bergstak® 0.8mm is a flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 pcb stack heights in 9 sizes up to 200 positions.  housing and terminal profile guarantees support of up to 12gb/s  vertical versus vertical mating configuration  40 to 200 position sizes in 20 position increments  5mm to 20mm stack heights in 1mm increments
 
基本的伯格斯塔克®0.8mm是一个灵活的解决方案设计的高速和高密度,平行板对板连接器系统与16pcb堆栈高度在9个尺寸到200个位置。外壳和终端轮廓保证支持高达12gb/s垂直与垂直配合配置40到200位置尺寸20位置增量5mm到20mm堆栈高度1mm增量
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