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HPCE® High Power Card Edge Connector
  • 产品概述
  • 主要用途
  • 产品规格
the high power card edge (hpce®) connector is a next generation power card edge connector for demanding applications requiring high linear current density and low power loss. hpce offers a low profile height (7.50mm) and is based on very cost effective and highly reliable stamped-and-formed power contact technology similar to other power solutions from amphenol.  hpce® incorporates an innovative power contact and housing design that permits a more compact and lower profile package for demanding ac and dc power supply and/or add-in card applications. hpce's low profile height (for maximized airflow), significantly increased linear current density and low contact resistance characteristics are ideal for next generation 1u/2u servers, storage enclosures, telecommunications equipment and data
 
高功率卡边缘(hpce®)连接器是下一代电源卡边缘连接器,用于要求高线性电流密度和低功率损耗的苛刻应用程序。hpce提供了一个低轮廓高度(7.50mm),并基于非常成本效益和高度可靠的冲压和成型的电力接触技术,类似于安苯酚的其他电力解决方案。hpce®采用了创新的电源接触和外壳设计,允许对要求较高的交流和直流电源和/或附加卡应用提供更紧凑和更低的包装。Hpce的低轮廓高度(用于最大的气流)、显著增加的线性电流密度和低接触电阻特性是下一代1u/2u服务器、存储框、电信设备和数据的理想选择
the high power card edge (hpce®) connector is a next generation power card edge connector for demanding applications requiring high linear current density and low power loss. hpce offers a low profile height (7.50mm) and is based on very cost effective and highly reliable stamped-and-formed power contact technology similar to other power solutions from amphenol.  hpce® incorporates an innovative power contact and housing design that permits a more compact and lower profile package for demanding ac and dc power supply and/or add-in card applications. hpce's low profile height (for maximized airflow), significantly increased linear current density and low contact resistance characteristics are ideal for next generation 1u/2u servers, storage enclosures, telecommunications equipment and data
 
高功率卡边缘(hpce®)连接器是下一代电源卡边缘连接器,用于要求高线性电流密度和低功率损耗的苛刻应用程序。hpce提供了一个低轮廓高度(7.50mm),并基于非常成本效益和高度可靠的冲压和成型的电力接触技术,类似于安苯酚的其他电力解决方案。hpce®采用了创新的电源接触和外壳设计,允许对要求较高的交流和直流电源和/或附加卡应用提供更紧凑和更低的包装。Hpce的低轮廓高度(用于最大的气流)、显著增加的线性电流密度和低接触电阻特性是下一代1u/2u服务器、存储框、电信设备和数据的理想选择
the high power card edge (hpce®) connector is a next generation power card edge connector for demanding applications requiring high linear current density and low power loss. hpce offers a low profile height (7.50mm) and is based on very cost effective and highly reliable stamped-and-formed power contact technology similar to other power solutions from amphenol.  hpce® incorporates an innovative power contact and housing design that permits a more compact and lower profile package for demanding ac and dc power supply and/or add-in card applications. hpce's low profile height (for maximized airflow), significantly increased linear current density and low contact resistance characteristics are ideal for next generation 1u/2u servers, storage enclosures, telecommunications equipment and data
 
高功率卡边缘(hpce®)连接器是下一代电源卡边缘连接器,用于要求高线性电流密度和低功率损耗的苛刻应用程序。hpce提供了一个低轮廓高度(7.50mm),并基于非常成本效益和高度可靠的冲压和成型的电力接触技术,类似于安苯酚的其他电力解决方案。hpce®采用了创新的电源接触和外壳设计,允许对要求较高的交流和直流电源和/或附加卡应用提供更紧凑和更低的包装。Hpce的低轮廓高度(用于最大的气流)、显著增加的线性电流密度和低接触电阻特性是下一代1u/2u服务器、存储框、电信设备和数据的理想选择
the high power card edge (hpce®) connector is a next generation power card edge connector for demanding applications requiring high linear current density and low power loss. hpce offers a low profile height (7.50mm) and is based on very cost effective and highly reliable stamped-and-formed power contact technology similar to other power solutions from amphenol.  hpce® incorporates an innovative power contact and housing design that permits a more compact and lower profile package for demanding ac and dc power supply and/or add-in card applications. hpce's low profile height (for maximized airflow), significantly increased linear current density and low contact resistance characteristics are ideal for next generation 1u/2u servers, storage enclosures, telecommunications equipment and data
 
高功率卡边缘(hpce®)连接器是下一代电源卡边缘连接器,用于要求高线性电流密度和低功率损耗的苛刻应用程序。hpce提供了一个低轮廓高度(7.50mm),并基于非常成本效益和高度可靠的冲压和成型的电力接触技术,类似于安苯酚的其他电力解决方案。hpce®采用了创新的电源接触和外壳设计,允许对要求较高的交流和直流电源和/或附加卡应用提供更紧凑和更低的包装。Hpce的低轮廓高度(用于最大的气流)、显著增加的线性电流密度和低接触电阻特性是下一代1u/2u服务器、存储框、电信设备和数据的理想选择
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