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D-Sub High Density Board-Mount Connectors
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  • 产品规格
basics d-sub high density board-mount connectors, based on the compact-d form factor, complete your board and system designs by providing high-density and high-speed interfaces. the high-speed, power, assembly and mechanical packaging expertise, aids in getting the signals out of the box at optimal cost and performance, while accommodating up to 78 positions in standard shell sizes. coupled with backplane, board-to-board, and cable connections, the connectors pave way to total solution for equipment designs. the products are ul recognized and lead-free.  positions from 15 to 78 compact-d design available in press-fit and pin-in-paste terminations
 
基本的d子高密度板安装连接器,基于紧凑的d外形因素,通过提供高密度和高速接口完成您的板和系统设计。高速、动力、组装和机械包装的专业知识,有助于以最佳的成本和性能从开箱取出信号,同时可容纳多达78个标准外壳尺寸的位置。加上背板、板和电缆连接,连接器为设备设计的全面解决方案铺平了道路。产品经市场认可,无铅。位置从15到78紧凑设计可在压装和销粘贴终端
basics d-sub high density board-mount connectors, based on the compact-d form factor, complete your board and system designs by providing high-density and high-speed interfaces. the high-speed, power, assembly and mechanical packaging expertise, aids in getting the signals out of the box at optimal cost and performance, while accommodating up to 78 positions in standard shell sizes. coupled with backplane, board-to-board, and cable connections, the connectors pave way to total solution for equipment designs. the products are ul recognized and lead-free.  positions from 15 to 78 compact-d design available in press-fit and pin-in-paste terminations
 
基本的d子高密度板安装连接器,基于紧凑的d外形因素,通过提供高密度和高速接口完成您的板和系统设计。高速、动力、组装和机械包装的专业知识,有助于以最佳的成本和性能从开箱取出信号,同时可容纳多达78个标准外壳尺寸的位置。加上背板、板和电缆连接,连接器为设备设计的全面解决方案铺平了道路。产品经市场认可,无铅。位置从15到78紧凑设计可在压装和销粘贴终端
basics d-sub high density board-mount connectors, based on the compact-d form factor, complete your board and system designs by providing high-density and high-speed interfaces. the high-speed, power, assembly and mechanical packaging expertise, aids in getting the signals out of the box at optimal cost and performance, while accommodating up to 78 positions in standard shell sizes. coupled with backplane, board-to-board, and cable connections, the connectors pave way to total solution for equipment designs. the products are ul recognized and lead-free.  positions from 15 to 78 compact-d design available in press-fit and pin-in-paste terminations
 
基本的d子高密度板安装连接器,基于紧凑的d外形因素,通过提供高密度和高速接口完成您的板和系统设计。高速、动力、组装和机械包装的专业知识,有助于以最佳的成本和性能从开箱取出信号,同时可容纳多达78个标准外壳尺寸的位置。加上背板、板和电缆连接,连接器为设备设计的全面解决方案铺平了道路。产品经市场认可,无铅。位置从15到78紧凑设计可在压装和销粘贴终端
basics d-sub high density board-mount connectors, based on the compact-d form factor, complete your board and system designs by providing high-density and high-speed interfaces. the high-speed, power, assembly and mechanical packaging expertise, aids in getting the signals out of the box at optimal cost and performance, while accommodating up to 78 positions in standard shell sizes. coupled with backplane, board-to-board, and cable connections, the connectors pave way to total solution for equipment designs. the products are ul recognized and lead-free.  positions from 15 to 78 compact-d design available in press-fit and pin-in-paste terminations
 
基本的d子高密度板安装连接器,基于紧凑的d外形因素,通过提供高密度和高速接口完成您的板和系统设计。高速、动力、组装和机械包装的专业知识,有助于以最佳的成本和性能从开箱取出信号,同时可容纳多达78个标准外壳尺寸的位置。加上背板、板和电缆连接,连接器为设备设计的全面解决方案铺平了道路。产品经市场认可,无铅。位置从15到78紧凑设计可在压装和销粘贴终端
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